Capabilities

CAPABILITIES

Capabilities & Technology

CPS Fluidics is dedicated to developing microfluidic systems and devices. Our design for manufacturing approach ensures that these devices will scale to the production level needed by our clients. We offer a diverse selection of materials and consistently seek to incorporate new technology advancements and equipment into our practices. Regardless of where you are in the design cycle, our high performing, durable products can accomplish various tasks to suit your every need.
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Our Process


With over 20 years of product development and manufacturing expertise, we’ve developed a highly adaptable process that allows us to identify and create the most appropriate solution in any given situation.

 

We start by working with clients and identifying their problems. This helps our team to determine their exact needs so we can then find ways to apply our unique technology into the construction of custom product solutions.

 

The materials used throughout this process will vary greatly depending on the application, whether it's for specific thermal properties, optical properties, or other such requirements.


Regardless of the design’s complexity, our system is optimized to render the same level of precision and high quality across all product lines.


Factory


CPS Fluidics is headquartered in Wallingford, Connecticut, just 20 minutes from Yale University. Its location is centrally located between Boston and New York City, near the world’s largest biotech industry. Our factory space is 25000 sqft, with additional expansion space available.



The factory contains 4 cleanrooms ranging from ISO class 5 to ISO class 8 with a total area of 5000 sqft. The vast majority of our capabilities are all done in-house by qualified technical staff. We use a few external partners to complement our offerings.


Component Fabrication

  • Die Cutting
  • Roll-to-roll Laser Cutting
  • Robotic Drag Knife
  • PDMS Casting
  • Hot Embossing
  • Injection Molding (Partnership)
  • Drilling and Milling
  • Glass Machining
  • Surface Grinding
  • Lapping/Polishing
  • Dicing
  • Coatings (Partnership)


Assembly and Bonding

All assembly is conducted in cleanroom environments to preserve integrity of your products.

  • Diverse material combinations:
    Glass, Plastics, PDMS, Silicone, Rubber, Electrodes, PTFE


  • Techniques
  • Thermal bonding
  • Diffusion bonding
  • Plasma bonding
  • Solvent bonding
  • Glass-on-glass bonding
  • Adhesive bonding (e.g. PSAs)


Metrology and QC


  • Coordinate-Measuring Machines (CMM)
  • Manual Gauging
  • Optical Metrology Systems
  • Machine Vision Inspection
  • Laser Displacement
  • Interferometry
  • Fluorescence Microscopy
  • Microplate Reader
  • Spectrophotometry
  • Atomic Force Microscopy

Chemistry


  • Chemical Vapor Deposition
  • Liquid Immersion Functionalization
  • Probe Immobilization
  • Automated Flow Through Immobilization

Cleaning


  • Detergent and DI Water Immersion
  • Ultrasonic
  • Plasma Etching
  • RCA and Piranha Solutions

Materials


Product solutions from a wide variety of hard and soft materials, including:


  • Hard materials:  glass, ceramics (SiN, SiC, etc), sapphire, silicon…


  • Soft materials: COC, PMMA, ABS, PEEK, PEI, PET…


  • Flexible materials: PDMS, films, Polyurethane, FKM, FFKM, …


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